Scanning electrochemical microscopy studies of micropatterned copper sulfide (CuxS) thin films fabricated by a wet chemistry method

摘要

► Copper sulfide (CuxS) microstructures on Si wafer has been prepared using a wet chemistry method. ► To obtain high quality CuxS films, preparative conditions were optimized. Scanning electrochemical microscopy (SECM) was employed to examine the properties of the CuxS films. ► The apparent electron-transfer rate constant (k) of CuxS surface was estimated as 0.04 cm/s. ► The SECM current map showed high edge acuity of the micro-patterned CuxS.